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Chapter 6: XG12 Chassis
This chapter provides details about the XG12 chassisits specifications and features.
The XG12 Chassis is the next generation high performance platform capable of supporting all XM form factor load modules, including full chassis configurations of the Xcellon load modules. It is a 12-slot chassis with increased total power capacity available for all load modules and front-to-back airflow delivery along with increased bandwidth from the CPU to the load modules.
The chassis provides improved modularity and access to the major components to reduce downtime of a failed chassis and to reduce the probability of needing to remove a failed chassis from the test environment. The four separate modules that make up the chassis are shown in Table 6-1.
The XG12, shown in Figure 6-1, allows the hot-swapping of load modules, without requiring the chassis to be powered down. The Processor module for the XG12 chassis is not hot swappable.
The Processor Module is plugged into the front of the chassis. The power supplies and fans are accessible from the rear of the chassis. Each of the modular components is capable of being removed in the field and replaced with minimum downtime.
Figure 6-1. XG12 Chassis
The component modules of the XG12 chassis are shown in the following figure:
Specifications
The XG12 chassis specifications are contained in the following tables:.
Table 6-3. XG12 Chassis Specifications
Table 6-4. XG12 Chassis controls and indicators
Front Panel Switches On/Off momentary power push button Monitor HD-DB15 Super VGA Ethernet Two RJ-45 10/100/1000Mbps Gigabit Ethernet Management Port. USB 4 USB dual type A, 4-pin jack connectors Sync In Single Sync In jack with a 4-pin RJ11 Sync Out Single Sync Out jack with a 4-pin RJ11 Front Panel Indicators See LEDs/LCD Display. 2 Paired LEDs above each slot position indicating Power and Active status. 2x16 LCD on front panel indicating chassis information.
Figure 6-2. Safety Features
XG12 chassis installation precautions:
- The chassis should be installed in the rack before installing the power supply module, fan module and load modules, thereby reducing the weight of the chassis.
- The two lower bolts used to secure the chassis to a rack can be used to hold the chassis frame in place while securing all of the other bolts (See Figure 6-2).
- Secure the chassis to rack face with all six bolts. Fully depress power supply clamps when installing power supply module.
- Secure the power supply module thumb bolt when installing power supply module.
- Install the rear power supply cover before applying AC power.
Note: After removing or installing this cover, ensure that the thumbscrews are tightened down with a screwdriver.
- Do not use the chassis without installing the Fan module.
- Do not use the chassis without installing the Processor module.
- Do not leave unused slots open. Use the filler panels to cover the un-used slots. See Installing Filler Panels for more information.
- Do not block the front air intake.
- A minimum air flow clearance of 12 inches is required. 24 inches of air flow clearance is preferred at the rear of the chassis.
- Operator intervention may be required to power cycle the XG12 chassis or restart a software program in the event the XG12 chassis operation is upset or stopped by electrostatic discharge.
LEDs/LCD Display
The XG12 chassis has front panel LEDs for each load module slot.
LCD Display
An LCD display is provided on the chassis to indicate the status of the chassis without an external display device (monitor). The LCD operates in two modes:
CPU Slot LED Definitions
The specifications of LEDs for the Processor module and the LEDs above the Processor module slot are shown in the following table:
ESD Discharge Warning: Operator intervention may be required to power cycle the unit or restart a software program in the event the unit is upset by electrostatic discharge.
Supported Modules
The modules that are supported on the XG12 are listed in the following table.
Hot-Swap Procedure
Each XG12 chassis provides the ability of removing and reinstalling a load module without requiring the removal of power from the rest of the chassis. The process of removing/installing a Load Module does not impact either the operation of the OS or remaining load modules installed in the chassis.
The hot-swap procedure is detailed in Appendix D Hot-Swap Procedure.
SFF Adapter Module
The XG12 adapter module allows Ixia Standard Form Factor (SFF) load modules to be adapted into the XG12 chassis. Figure 6-3 shows an SFF adapter module.
Figure 6-3. SFF Adapter
A SFF load module is inserted into the front of the adapter and connects to the pins in the rear of the adapter. The entire assembly can then be inserted into any XG12 chassis slot.
Once an adapter module is installed in a chassis, SFF load modules can be hot-swapped without removing the SFF load module from the chassis.
Figure 6-4 shows an SFF Adapter module with a legacy ATM card.
Figure 6-4. SFF Adapter with ATM Module
Table 6-7 identifies the modules that can be used with the SFF Adapter.
Cooling Fan Speed Control
The XG12 chassis automatically monitors and measures the temperature of installed load modules. The XG12 automatically adjusts the fan speed to maintain proper cooling.
Power outage recovery and Automatic booting scenario
The BIOS on the XG12 is set to Power On after a power failure.
The XG12 chassis will start up, boot Windows 7 and automatically login to the Ixia user account. Anything that is in the Startup folder will also launch..
Rack Mount Cautions
Caution: If this unit is installed in a network equipment rack, please observe the following precautions.
- Elevated Operating Ambient Temperature: If installed in a closed or multi-unit rack assembly, the operating ambient temperature of the rack environment may be greater than room ambient temperature. Therefore, consider installing the equipment in an environment that is compatible with the maximum allowable ambient temperature specified for the chassis (40° C).
- Reduced Air Flow: Install the equipment in a rack so that the amount of air flow required for safe operation of the equipment is not reduced. Do not block the back or the front of the chassis, and leave approximately 12 inches of space, 24 inches preferred, for the back of the unit for proper ventilation. The air flow clearance should be 12 inches on the front.
- Mechanical Loading: Mount the chassis so that is it level in the rack and that a hazardous condition is not caused. Please install all six mounting bolts.
- Circuit Overloading: Consider the connection of the equipment to the supply circuit and the effect that overloading of the circuits might have on overcurrent protection and supply wiring. Pay attention to equipment nameplate ratings when addressing this concern.
- Reliable Earthing: Maintain reliable earthing (grounding) of rack-mounted equipment. Chassis frame should be screwed down to racks to ensure proper grounding path. In Addition, Pay special attention to supply connections other than direct connections to the branch circuit (such as use of power strips).
- Replacement of the power supply cord must of the same type cord and plug configuration that was shipped with the unit.
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